Keywords: arm board, single board computer, development board
FD7352P is a highly integrated, low-cost combo module with high-performance and low-power. It supports Wi-Fi 6 and Bluetooth 5.4 protocol, supports Wi-Fi MAC of the final version of Wi-Fi 6 Wave2 protocol, Wi-Fi Baseband of 2T2R, and high-performance RF. It also
supports PCIE, HS-UART and PCM interfaces for connection with the Host. This module also supports BT and Wi-Fi to work in coexistence mode. It is suitable for consumer electronics such as IPC, tablet and IOT, and can also be used in fields with high reliability requirements such as industrial interconnection.
| Wi-Fi Characteristics |
| 1. IEEE 802.11a/b/g/n/ac/ax (supports wave-2) wireless LAN communication protocol |
| 2. IEEE 802.11 d/e/h/i/k/mc/r/v/w |
| 3. 2.4G Phy rate up to 572.4Mbps, 5G Phy rate up to 1.2Gbps; Throughput 1Gbps |
| 4. Multiple modes such as Wi-Fi STA, AP, and P2P |
| 5. Support DBDC, DBSC |
| 6. 2.4G 40MHZ, 5G 80MHz bandwidth, 2T/2R |
| 7. Up to 1024QAM modulation, supports LDPC and STBC |
| 8. UL/DL OFDMA, UL/DL MU-MIMO |
| 9. QoS, WFA WMM, WMM PS |
| 10. RSSI and CSI Reporting |
| 11. Beamformee and 4*2 Tx Beamforming、2*2/2*1 Tx Beamforming |
| 12. WPA, WPA2, WPA3 encryption and decryption, WAPI and WPS2.0 |
| 13. ER, DCM to improve transceiver gain |
| 14. 20in40/80/160, 80in160 HE PPDU, Partial band MU MIMO to improve air interface utilization |
| 15. BSS Color, Spatial Reuse to improve air interface utilization |
| 16. TWT, to optimize dynamic power consumption in multi-BSS environment |
| Bluetooth Characteristics |
| 1.Support Bluetooth (Classic BT+BLE) v2.1, v3.0, v4.2, v5.4 features |
| 2.PCIE interface for BT data transmission |
| 3.PCM/IIS interface for audio transmission |
| 4.BR/EDR/LE 1M/LE 2M/LE LR |
| 5.Support sco and esco link |
| 6.SSP/Secure Connection |
| 7.Low power mode (sniff, sniff sub-rating) |
| 8.Support BT/Wi-Fi coexistence |
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