Keywords: arm board, single board computer, development board
FD7256S is a highly integrated, low-cost combo module with high performance and lowpower. It supports Wi-Fi 6 and Bluetooth 5.0 protocol, supports Wi-Fi MAC of the final version of Wi-Fi 6 Wave2 protocol, Wi-Fi Baseband of 1T1R, and high-performance RF. It also supports SDIO3.0, HS-UART, and PCM interfaces for connection with the Host. This module also supports BT and Wi-Fi to work in coexistence mode. It is suitable for consumer electronics such as IPC, tablets, and IOT, and can also be used in fields with high-reliability requirements such as industrial interconnection
Wi-Fi Characteristics |
IEEE 802.11a/b/g/n/ac/ax (supports wave-2) wireless LAN communication protocol |
IEEE 802.11 d/e/h/i/k/mc/r/v/w |
Phy rate up to 600.5Mbps, Throughput rate up to 520Mbps |
Multiple modes such as Wi-Fi STA, AP, and P2P |
2.4G 40MHZ, 5G 80MHz bandwidth, 1T/1R |
Up to 1024QAM modulation, supports LDPC and STBC |
UL/DL OFDMA, DL MU-MIMO |
QoS, WFA WMM, WMM PS |
RSSI and CSI Reporting |
Beamformee and 4*1 Tx Beamforming |
WPA, WPA2, WPA3 encryption and decryption, WAPI and WPS2.0 |
ER, DCM to improve transceiver gain |
20in40/80/160, 80in160 HE PPDU, Partial band MU MIMO to improve air interface utilization |
BSS Color, Spatial Reuse to improve air interface utilization |
TWT, Intra-PPDU PS, VHT TXOP PS to optimize dynamic power consumption in small bandwidth and multi-BSS environment |
Bluetooth Characteristics |
Support Bluetooth (Classic BT+BLE) v2.1, v3.0, v4.2, v5.0 features |
SDIO interface for BT data transmission |
PCM/IIS interface for audio transmission |
BR/EDR/LE 1M/LE 2M/LE LR |
Support sco and esco link |
SSP/Secure Connection |
Low power mode (sniff, sniff sub-rating) |
Support BT/Wi-Fi coexistence |
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